ATS-59004-C1-R0

Advanced Thermal Solutions
984-ATS-59004-C1-R0
ATS-59004-C1-R0

制造商：

说明：
散热片 maxiGRIP Heat Sink Assembly, Black-Anodized, T766, 25mm Comp, 43x55x12mm

数据表:
ECAD模型:
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供货情况

库存：
无库存
生产周期：
8 周 预计工厂生产时间。
最少： 100   倍数： 100
单价:
¥-.--
总价:
¥-.--
预估关税:
此产品免运费

定价 (含13% 增值税)

数量 单价
总价
¥195.7047 ¥19,570.47
¥186.3596 ¥37,271.92
¥182.2238 ¥91,111.90

产品属性 属性值 选择属性
Advanced Thermal Solutions
产品种类: 散热片
RoHS:  
Heat Sink Assemblies
BGA
Snap On
Aluminum
maxiFLOW
3.2 C/W
55 mm
43 mm
12 mm
商标: Advanced Thermal Solutions
颜色: Black
组装国: Not Available
扩散国家: Not Available
原产国: CN
封装: Bulk
产品类型: Heat Sinks
系列: maxiGRIP HS ASM - Custom
工厂包装数量: 100
子类别: Heat Sinks
商标名: maxiFLOW maxiGRIP
类型: Component
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已选择的属性: 0

数据表

Test/Quality Data

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CNHTS:
7616991090
USHTS:
7616995190
TARIC:
7616991099
MXHTS:
7616995195
ECCN:
EAR99

maxiFLOW™ Heat Sinks

Advanced Thermal Solutions maxiFLOW™ Heat Sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The ATS heat sink design provides high thermal performance for the physical volume it occupies compared to other designs. These ATS cooling solutions are offered in a variety of fin types, including maxiFLOW, straight fin, pin-fin, and cross-cut designs. The straight-fin heat sinks are well-suited for systems with open airflow from front to back. The pin-fin design offers superior cooling in spatially constrained PCB layouts when the airflow direction near the device is ambiguous. The cross-cut fin design allows cooling air to enter from any direction.

BGA High-Performance Heat Sinks for NXP

Advanced Thermal Solutions, Inc. (ATS) BGA High-Performance Heat Sinks are designed for NXP MPC flip-chip processors. The BGA heat sinks feature the maxiGRIP™ attachment which applies steady, even pressure to the component and does not require holes in the PCB. The heat sink comes pre-assembled with a high-performance phase change thermal interface material for ease of installation.

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