ATS020020007-SF-7F Advanced Thermal Solutions

说明：

散热片 BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 20x20x7mm

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产品属性	属性值	选择属性
制造商:	Advanced Thermal Solutions
产品种类:	散热片
交货限制:	Mouser 目前在您所在地区不销售该产品。
RoHS:
产品:	Heat Sinks
设计目的:	BGA
安装风格:	PCB
散热片材料:	Aluminum
散热片样式:	Straight Fin
热阻:	19.93 C/W
长度:	20 mm
宽度:	20 mm
高度:	7 mm
商标:	Advanced Thermal Solutions
颜色:	Black
组装国:	Not Available
扩散国家:	Not Available
原产国:	CN
封装:	Bulk
产品类型:	Heat Sinks
系列:	BGA High Aspect Ratio
工厂包装数量:	100
子类别:	Heat Sinks
商标名:	Value-Line Platform
类型:	Component

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数据表

ATS020020007-SF-7F 数据表 (PDF)

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USHTS:: 7616995100
ECCN:: EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.