TGP40000SF-0.060-01-0606-NA

Bergquist Company
951-TGP400SF.0600166
TGP40000SF-0.060-01-0606-NA

制造商:

说明:
导热接口产品 GAP PAD, Sil-Free, 40W/m-K, 6 x 6" Sheet, Tacky Pad, 0.060" Thickness, Thermexit

寿命周期:
新产品:
此制造商的新产品。
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库存量: 8

库存:
8
可立即发货
在途量:
10
生产周期:
7
大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:
此产品免运费

定价 (含13% 增值税)

数量 单价
总价
¥2,014.1007 ¥2,014.10
¥1,806.7796 ¥18,067.80
¥1,696.9097 ¥50,907.29
¥1,659.6536 ¥82,982.68

产品属性 属性值 选择属性
Bergquist Company
产品种类: 导热接口产品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone-Free Polymer
40 W/m-K
Black
- 40 C
+ 150 C
152.4 mm
152.4 mm
1.524 mm
TGP 40000SF
商标: Bergquist Company
组装国: Not Available
扩散国家: Not Available
原产国: US
设计目的: Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
高度: 6 in
产品类型: Thermal Interface Products
大小: 6 in x 6 in
工厂包装数量: 10
子类别: Thermal Management
商标名: GAP PAD / Thermexit
零件号别名: TGP40000SF-0.060-01-0606 2987873
单位重量: 60 g
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已选择的属性: 0

CAHTS:
3920990000
USHTS:
3920995000
ECCN:
EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.