您似乎禁用了您浏览器中的JavaScript功能。本网页上的某些功能需要登录后才能使用。

TGP40000SF-0.125-01-0606-NA

Name: Bergquist Company TGP40000SF-0.125-01-0606-NA
Brand: Bergquist Company
SKU: 951-TGP400SF.1250166
Price: 3137.51 RMB
Availability: InStock

图像仅供参考
请参阅产品规格

Mouser编号：

951-TGP400SF.1250166

制造商编号：

TGP40000SF-0.125-01-0606-NA

制造商：

Bergquist Company

说明：

导热接口产品 GAP PAD, Sil-Free, 40W/m-K, 6 x 6" Sheet, Tacky Pad, 0.125" Thickness, Thermexit

寿命周期:

新产品:

此制造商的新产品。

数据表:

TGP40000SF-0.125-01-0606-NA 数据表 (PDF)

ECAD模型:

下载免费库加载程序，将此文件转换，以供您的ECAD工具使用。了解详情。

更多信息

了解Bergquist Company TGP40000SF-0.125-01-0606-NA详情

库存量: 3

库存：: 3 可立即发货

出现意外错误。请稍候重试。
生产周期：: 7 周大于所示数量的预计工厂生产时间。

输入数量：

最少： 1 倍数： 1

单价:

¥-.--

总价:

¥-.--

预估关税:

此产品免运费

定价 (含13% 增值税)

数量	单价	总价
	¥3,545.3863	¥3,545.39
	¥3,266.6718	¥32,666.72
	¥3,033.3833	¥75,834.58

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

产品属性	属性值	选择属性
制造商:	Bergquist Company
产品种类:	导热接口产品
RoHS:
产品:	Gap Fillers / Gap Pads / Sheets
类型:	Thermal Pad
封装 / 箱体:	Non-standard
材料:	Silicone-Free Polymer
导热性:	40 W/m-K
颜色:	Black
最小工作温度:	- 40 C
最大工作温度:	+ 150 C
长度:	152.4 mm
宽度:	152.4 mm
厚度:	3.175 mm
系列:	TGP 40000SF
商标:	Bergquist Company
组装国:	Not Available
扩散国家:	Not Available
原产国:	US
设计目的:	Silcone Sensitive Applications, Telecommunications, Optical, ASICs/DSPs, Storage, Automotive, Power Converters, Aerospace, LEDs and Lasers
高度:	4 in
产品类型:	Thermal Interface Products
大小:	6 in x 6 in
工厂包装数量:	5
子类别:	Thermal Management
商标名:	GAP PAD / Thermexit
零件号别名:	TGP40000SF-0.125-01-0606 2987848
单位重量:	125 g

找到的产品:

要显示类似产品，至少选中一个复选框

要显示该类别下的类似产品，请至少选中上方的一个复选框。

已选择的属性: 0

筛选文档:

数据表

TGP40000SF-0.125-01-0606-NA 数据表 (PDF)

Images

MSDS

Safety Data Sheet (PDF)

Product Catalogs

Technical Resources

Product Presentation (PDF)

USHTS:: 3921905050
ECCN:: EAR99

TGP 40000SF 40W/m-K Silicone Free GAP PAD®

Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD® features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity. The GAP PAD thermal interface products, formerly known as Thermexit, are uniquely designed for thermal management applications requiring silicone-free solutions. Due to its oriented filler technology, the TGP 40000SF series delivers excellent thermal performance at 56psi peak pressure. The GAP PAD products offer a higher thermal conductivity rating than previous thermal interface materials (TIMs) with easier handling, lower density, and a more lightweight sheet thickness. The TGP 40000SF 40W/m-K GAP PAD polymer construction allows low liquid migration without silicone outgassing or mobile polymer bleed, and these models include tack on one side. Bergquist TGP 40000SF 40W/m-K Silicone Free GAP PAD products are ideal for various applications, including telecommunications, automotive modules, and aerospace modules.