2504026007Y0

Fair-Rite
623-2504026007Y0
2504026007Y0

制造商:

说明:
铁氧体磁珠 Multilayer Chip BD 0.5/0.5/1-Y0-600

ECAD模型:
下载免费库加载程序,将此文件转换,以供您的ECAD工具使用。了解详情。

库存量: 23,452

库存:
23,452 可立即发货
生产周期:
20 周 大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:
封装:
整卷卷轴(请按10000的倍数订购)

定价 (含13% 增值税)

数量 单价
总价
剪切带/MouseReel™
¥1.4916 ¥1.49
¥1.02604 ¥10.26
¥0.89383 ¥22.35
¥0.8023 ¥40.12
¥0.71981 ¥71.98
¥0.61246 ¥153.12
¥0.54579 ¥272.90
¥0.48025 ¥480.25
¥0.37177 ¥1,487.08
整卷卷轴(请按10000的倍数订购)
¥0.37177 ¥3,717.70
† ¥15.00 MouseReel™费将被加上并在购物车计算。所有MouseReel™订单均不可撤消和退回。

产品属性 属性值 选择属性
Fair-Rite
产品种类: 铁氧体磁珠
RoHS:  
25
Ferrite Chip Beads
SMD/SMT
0402 (1005 metric)
60 Ohms
200 mA
25 %
400 mOhms
- 55 C
+ 125 C
1 mm
0.5 mm
0.5 mm
Reel
Cut Tape
MouseReel
商标: Fair-Rite
组装国: Not Available
扩散国家: Not Available
原产国: TW, CN
产品类型: Ferrite Beads
工厂包装数量: 10000
子类别: Ferrites
测试频率: 100 MHz
类型: Multilayer Ferrite Chip Bead
单位重量: 0.650 mg
找到的产品:
要显示类似产品,至少选中一个复选框
要显示该类别下的类似产品,请至少选中上方的一个复选框。
已选择的属性: 0

CNHTS:
8548000001
CAHTS:
8548000000
USHTS:
8548000000
JPHTS:
854800000
KRHTS:
8504502090
TARIC:
8504509590
MXHTS:
8504509102
BRHTS:
85045000
ECCN:
EAR99

Surface-Mount Ferrite Beads

Fair-Rite Surface-Mount (SM) Ferrite Beads feature a rugged construction that lowers the DC resistance and increases current-carrying capacity. The SM beads meet the solderability specifications when tested in accordance with MIL-STD-202, method 208. These ferrite beads from Fair-Rite are available in several materials and sizes with a recommended operating temperature of -55°C to +125°C.

Series 25 Multilayer Chip Beads

Fair-Rite Series 25 Multilayer Chip Beads include a broad selection of cost-effective multilayer chip beads to suppress conducted EMI signals. The chip beads are available in standard, high, and GHz signal speeds. These chips are stored and operated at a temperature range of -55°C to +125°C. Fair-Rite Multilayer Chip Beads can be ideally used in devices such as cellular phones, computers, laptops, and pagers. These small package sizes accommodate automated placements and allow for a dense packaging of circuit boards.