A18443-06 Laird Technologies

说明：

导热接口产品 18x18IN, Tflex HD7.5,1.50

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产品属性	属性值	选择属性
制造商:	Laird Technologies
产品种类:	导热接口产品
交货限制:	Mouser 目前在您所在地区不销售该产品。
RoHS:
产品:	Gap Fillers / Gap Pads / Sheets
类型:	Gap Filler
封装 / 箱体:	Non-standard
导热性:	7.5 W/m-K
颜色:	Gray
最小工作温度:	- 50 C
最大工作温度:	+ 125 C
长度:	1.5 ft
宽度:	1.5 ft
厚度:	1.5 mm
系列:	Tflex
封装:	Bulk
商标:	Laird Technologies
组装国:	Not Available
扩散国家:	Not Available
原产国:	CN
产品类型:	Thermal Interface Products
工厂包装数量:	1
子类别:	Thermal Management
商标名:	Tflex

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USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Tflex™ HD7.5 Thermal Gap Filler

Laird Technologies Tflex™ HD7.5 Thermal Gap Filler is a soft silicone material that offers high deflection and 7.5W/mK thermal conductivity. The HD7.5 series is designed to provide superior pressure vs. deflection characteristics. The material offers minimal stress on components during application while maintaining low thermal resistance. Additional features include low outgassing and oil bleeding, 3.4g/cc density, and -40°C to +150°C temperature range. Laird Technologies Tflex HD7.5 Thermal Gap Filler is available in 18" x 18" and 9" x 9" standard sheet sizes with thicknesses ranging from 1mm to 5mm in 0.25mm increments.