HDTM-3-08-2-S-VT-0-4

Samtec
200-HDTM-3082SVT04
HDTM-3-08-2-S-VT-0-4

制造商:

说明:
高速/模块连接器 XCede(R) HD 1.80 mm High-Density Backplane Vertical Header

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产品属性 属性值 选择属性
Samtec
产品种类: 高速/模块连接器
交货限制:
 Mouser 目前在您所在地区不销售该产品。
RoHS:  
Headers
8 Row
1.8 mm
Solder Pin
Gold
HDTM
Tray
商标: Samtec
触点材料: Copper Alloy
组装国: Not Available
扩散国家: Not Available
原产国: CN
外壳颜色: Black
外壳材料: Liquid Crystal Polymer (LCP)
最大工作温度: + 105 C
最小工作温度: - 40 C
安装角: Vertical
产品类型: High Speed / Modular Connectors
工厂包装数量: 60
子类别: Backplane Connectors
商标名: XCede
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已选择的属性: 0

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

XCede® HD High-Density Backplane Systems

Samtec XCede® HD High-Density Backplane Systems combine a small form factor with incredible design flexibility for system and board space savings. These backplane systems allow for creating a fully custom backplane solution with guidance and keying, power modules, and sidewalls for increased durability. Samtec XCede HD backplane systems help prevent system downtime by implementing a staggered differential pin design where the ground pins mate first for hot-plugging. These backplane systems feature a 1.8mm column pitch, up to 3mm contact wipe on signal pins, and multiple signal/ground pin staging options. 

XCede® HD HDTM 1.8mm Vertical Backplane Headers

Samtec XCede® HD HDTM 1.8mm Vertical Backplane Headers feature a 1.8mm column pitch, keying, guidance, and up to 3mm contact wipe on signal pins. These headers consist of three levels of sequencing that enable hot-plugging and are available in 3-, 4-, and 6-pair designs with 4, 6, or 8 columns. Samtech HDTM headers are designed using liquid crystal polymer (LCP) housing material and phosphor bronze contact material. These RoHS-compliant headers operate at -40°C to +105°C temperature range. The XCede HD HDTM vertical backplane headers mate with the XCede HD HDTF right-angle backplane receptacles.