2007637-6

TE Connectivity
571-2007637-6
2007637-6

制造商：

说明：
I/O 连接器 SFP+assy 2x2 Spring Fingers Inner LP Sn

数据表:
ECAD模型:
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库存量: 59

库存：
59 可立即发货
生产周期：
6 周 大于所示数量的预计工厂生产时间。
数量大于59的订购须受最低订购要求的限制。
最少： 1   倍数： 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥338.1412 ¥338.14
¥293.9695 ¥2,939.70
¥281.2344 ¥5,624.69
¥272.217 ¥16,333.02
¥236.8141 ¥23,681.41
¥236.6559 ¥61,530.53
1,000 报价

产品属性 属性值 选择属性
TE Connectivity
产品种类: I/O 连接器
RoHS:  
Cage Assemblies
80 Position
0.8 mm
Gold
Through Hole
Press Fit
Right Angle
SFP+
- 55 C
+ 105 C
商标: TE Connectivity
组装国: Not Available
扩散国家: Not Available
原产国: CN
产品类型: I/O Connectors
工厂包装数量: 20
子类别: I/O Connectors
单位重量: 59.363 g
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已选择的属性: 0

数据表

Images

CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
85366999
BRHTS:
85366990
ECCN:
EAR99

TE Connectivity SFP+ I/O

TE Connectivity's SFP+ product family extends the use of the Small Form-Factor Pluggable (SFP) interconnect up to 10Gb/s. This system meets the performance requirements of SFF (Small Form-Factor) specification SFF-8431 and supports 8G Fiber Channel and 10G Ethernet applications. The SFP+ product family includes cages, connectors, and copper cable assemblies.
Learn More

SFP+ Enhanced Connectors

TE Connectivity SFP+ Enhanced Connectors improve thermal performance and EMI containment in applications with demanding bandwidth and data rates. The SFP+ thermal improvements provide an average 3% reduction in temperature, per port, increasing efficiency while requiring less power to operate the overall system. The new enhanced signal quality reduces EMI by approximately 10-12 dBm (within the 10-15 GHz range) due to the internal redesign of the retention and latch plates achieving better electrical connections and product strength while preventing leakage.

SFP+ Family Interconnect System

TE Connectivity SFP+ I/O Interconnects are designed to transfer data at speeds of up to 16Gb/s. The portfolio features 20-position SMT connectors as well as cages in multiple configurations, and with elastomeric gasket or enhanced EMI springs to address EMI containment at higher data rates. TE SFP+ Interconnect family also includes thermal- and EMI-enhanced stacked configurations to further improve performance. Complementary SFP+ direct-attach copper cable assemblies are also offered as high-speed, cost-effective alternatives to fiber optic cables. The assemblies enable hardware OEMs and data center operators to achieve high port density and configurability at low costs and with reduced power requirements.

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