292207-6

TE Connectivity
571-292207-6
292207-6

制造商：

说明：
集管和线壳 6P DIP HDR VT MINI NAT 1.5mm

数据表:
ECAD模型:
下载免费库加载程序，将此文件转换，以供您的ECAD工具使用。了解详情。

库存量: 3,928

库存：
3,928 可立即发货
生产周期：
4 周 大于所示数量的预计工厂生产时间。
最少： 1   倍数： 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥5.1302 ¥5.13
¥4.1245 ¥41.25
¥3.9889 ¥99.72
¥3.5369 ¥353.69
¥3.164 ¥791.00
¥3.0171 ¥3,017.10

产品属性 属性值 选择属性
TE Connectivity
产品种类: 集管和线壳
RoHS:  
Headers
Shrouded
6 Position
1.5 mm (0.059 in)
1 Row
Through Hole
Solder Pin
Straight
Pin (Male)
Tin
Mini CT
Common Termination
Wire-to-Board
- 30 C
+ 105 C
Tray
商标: TE Connectivity
触点材料: Brass
触点类型: Pin (Male)
组装国: Not Available
扩散国家: Not Available
原产国: CN
电流额定值: 2 A
外壳颜色: Natural
产品类型: Headers & Wire Housings
工厂包装数量: 1300
子类别: Headers & Wire Housings
电压额定值: 50 V
单位重量: 328 mg
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已选择的属性: 0

数据表

Images

PCN

CNHTS:
8536901100
TARIC:
8536693000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

Mini CT Connectors

TE Connectivity / AMP Mini CT Connectors are super-miniature, wire-to-board and wire-to-wire connections using panel-mount intermediary post headers. From 2 to 20 positions, applicable wire sizes AWG28-26, the Mini CT Connectors are used for harness-making by AMP high-speed crimping machines. The Tyco Electronics / AMP Mini CT Connectors consist of wire-mount receptacle connectors and a variety of post headers and two-row headers. The post headers include one-row type headers (DIP, SMT, intermediary panel-mount type) and two-row type headers (DIP, intermediary panel-mount type). Two-row type post headers incorporate two receptacle connectors in a holder.

HPI and CT Connectors

TE Connectivity / AMP High Performance Interconnects (HPI) polarized connectors feature reliable wire-to-board sockets and headers that provide audible click feedback when mating. The connectors are available in 2 to 15 positions and accommodate AWG 30 to 24 wire. TE Connectivity / AMP Common Termination (CT) Connectors feature mini 1.5mm and 2mm post header, receptacle, and crimp type housing assemblies for wire-to-board applications. The devices are available in 1 row and 2 row types and feature insulation displacement contacts (IDC).

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