LMV324MT/NOPB
图像仅供参考
请参阅产品规格
请参阅产品规格
926-LMV324MT/NOPB
LMV324MT/NOPB
制造商：
说明：
运算放大器 - 运放 Low Volt Quad Op Amp A 926-LMV324MTX/NOP A 926-LMV324MTX/NOPB
运算放大器 - 运放 Low Volt Quad Op Amp A 926-LMV324MTX/NOP A 926-LMV324MTX/NOPB
数据表:
库存量: 2,954
-
库存：
-
2,954 可立即发货出现意外错误。请稍候重试。
-
生产周期：
-
12 周 大于所示数量的预计工厂生产时间。
定价 (含13% 增值税)
| 数量 | 单价 |
总价
|
|---|---|---|
| ¥16.1251 | ¥16.13 | |
| ¥11.9102 | ¥119.10 | |
| ¥9.7632 | ¥244.08 | |
| ¥9.1869 | ¥863.57 | |
| ¥9.0174 | ¥2,542.91 | |
| ¥8.6897 | ¥4,900.99 | |
| ¥8.4411 | ¥8,728.10 | |
| ¥8.1699 | ¥20,735.21 | |
| ¥7.8535 | ¥39,864.37 |
备用包装
类似产品
Texas Instruments
运算放大器 - 运放 Quad 5.5-V 1-MHz RRO op amp 14-TSSOP A 9 A 926-LMV324MT/NOPB
数据表
Images
Models
PCN
- Add Cu as Alternative Wire Base Metal for Selected Device(s) (PDF)
- Packing Material change for Select Devices on TSSOP Package (PDF)
- Process change notifiation (PDF)
- Product Change Notification (PDF)
- Product Change Notification (PDF)
- Qualification of copper wire as alternate bonding material for selected products in TSSOP Package (PDF)
- Qualification of copper wire as alternate bonding material for selected products in TSSOP Package (PDF)
- Qualification of selected TSSOP devices in TI Malaysia (PDF)
- Replacing Tungsten at Metal One with standard aluminum metallization architecture on select devices in the CS80 Fab process at Maine Fab (PDF)
SPICE Models
- CNHTS:
- 8542339000
- CAHTS:
- 8542330000
- USHTS:
- 8542330001
- JPHTS:
- 8542330996
- KRHTS:
- 8532331000
- MXHTS:
- 8542330201
- ECCN:
- EAR99
