LPH0004

Versarien
489-LPH0004
LPH0004

制造商:

说明:
散热片 The factory is currently not accepting orders for this product.

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库存量: 407

库存:
407 可立即发货
数量大于407的订购须受最低订购要求的限制。
本产品所报告的交付时间长。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥97.6885 ¥97.69
¥89.496 ¥894.96
¥84.2076 ¥2,105.19
¥79.326 ¥3,966.30
¥76.5123 ¥7,651.23
¥72.8737 ¥18,218.43
¥70.2295 ¥35,114.75
¥67.7435 ¥67,743.50

产品属性 属性值 选择属性
Versarien
产品种类: 散热片
RoHS:  
Heat Sinks
Component, 20x20mm
Copper
20 mm
20 mm
5 mm
商标: Versarien
组装国: Not Available
扩散国家: Not Available
原产国: GB
产品类型: Heat Sinks
系列: LPH
工厂包装数量: 1
子类别: Heat Sinks
商标名: VersarienCu
单位重量: 14.128 g
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已选择的属性: 0

CNHTS:
7419809100
USHTS:
7419805050
JPHTS:
741980000
KRHTS:
7419809000
TARIC:
7616999099
ECCN:
EAR99

Low Profile Metallic Foam Heat Sinks

Versarien Low Profile Metallic Foam Heat Sinks offer unparalleled thermal performance in low-profile applications. These heat sinks use VersarienCu™ micro-porous metallic copper foam. The interconnected pores of the foam create a large surface area. The surface area combined with the excellent thermal conductivity of copper allow for the height of the heat sinks to be reduced without sacrificing performance. A thin, hard layer of high temperature copper oxide improves the emissivity of the foam, boosting the radiant properties of the heat sink and reducing the temperature of the component. Versarien Low Profile Metallic Foam Heat Sinks are designed for use in passive cooling applications where space is at a premium and performance is crucial. VersarienCu heat sinks can be used to cool any IC (integrated circuit) component.