说明：

导热接口产品 Thermally Conductive Interface Pad 210mm x 300mm X .5mm Silicone Polymer

ECAD模型:

下载免费库加载程序，将此文件转换，以供您的ECAD工具使用。了解详情。

定价 (含13% 增值税)

数量	单价	总价
	¥191.0717	¥191.07
	¥169.1497	¥1,691.50
	¥161.0476	¥4,026.19
	¥148.9679	¥11,917.43
	¥145.996	¥35,039.04
	¥144.4253	¥80,878.17

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

产品属性	属性值	选择属性
制造商:	3M
产品种类:	导热接口产品
产品:	Gap Fillers / Gap Pads / Sheets
类型:	Thermally Conductive Tape
封装 / 箱体:	Non-standard
材料:	Silicone Elastomer
导热性:	1 W/m-K
颜色:	White
最小工作温度:	- 40 C
最大工作温度:	+ 125 C
长度:	300 mm
宽度:	210 mm
厚度:	0.5 mm
可燃性等级:	UL 94 V-0
系列:	5583S
商标:	3M Electronic Specialty
组装国:	Not Available
扩散国家:	Not Available
原产国:	KR
产品类型:	Thermal Interface Products
工厂包装数量:	80
子类别:	Thermal Management
零件号别名:	5583S 00051131288980 7010405242
单位重量:	55.238 g

找到的产品:

要显示类似产品，至少选中一个复选框

要显示该类别下的类似产品，请至少选中上方的一个复选框。

已选择的属性: 0

筛选文档:

数据表

5583S-05 数据表 (PDF)

CNHTS:: 3824999999
USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

导热界面垫片

3M™导热界面垫片设计用于在发热元件、散热器和其他冷却设备之间提供优化的热传递路径。界面垫片由高度兼容且略带粘性的硅胶弹性体和导热陶瓷颗粒制成，有助于增强导热性并提供出色的绝缘性能。典型应用包括集成电路 (IC) 芯片封装热传导、散热片接触面、LED板热接口材料 (TIM)、覆晶薄膜 (COF) 热传导。

Thermally Conductive Adhesive Tapes

3M™ Thermally Conductive Tapes offer a wide range that can be used in various thermal interface solutions, including cushion gasket tape, XYZ-axis thermally conductive tape, double-sided tape, adhesive transfer tape, and water contact indicator tape variants. These thin, highly conformable thermal interfaces and heat-spreading tapes provide high adhesion and excellent thermal conductivity. The tapes apply quickly and easily. A good dielectric strength makes these tapes appropriate for applications, including bonding heat sinks, heat spreaders, and other cooling devices to the IC packages, power transistors, and other heat-generating components.

Thermal Interface Solutions

3M™ Thermal Interface Solutions includes electrically conductive transfer tapes and conductive interface pads. The electrically conductive tapes are a wide range that can be used in various thermal interface solutions. Thermally conductive silicone interface pads are designed to provide a heat transfer path between heat-generating components, heat sinks, and other cooling devices.