GPHC5.0-0.060-02-0816

Bergquist Company
951-GPHC5.0-6002-816
GPHC5.0-0.060-02-0816

制造商：

说明：
导热接口产品 GAP PAD, S-Class, 8"x16" Sheet, 0.060" Thickness, TGPHC5000/HC 5.0, IDH 2195378

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库存：
0

您可以延期订购此产品。

生产周期：
5 周 大于所示数量的预计工厂生产时间。
最少： 1   倍数： 1
单价:
¥-.--
总价:
¥-.--
预估关税:
此产品免运费

定价 (含13% 增值税)

数量 单价
总价
¥866.3484 ¥866.35
¥769.417 ¥7,694.17
¥765.8575 ¥19,146.44
¥759.3487 ¥37,967.44
¥756.5689 ¥75,656.89
250 报价

产品属性 属性值 选择属性
Bergquist Company
产品种类: 导热接口产品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Thermal Pad
Non-standard
Silicone
5 W/m-K
5 kVAC
Gray
- 60 C
+ 200 C
406.4 mm
203.2 mm
1.524 mm
17.5 psi
UL 94 V-0
HC 5.0 / TGP HC5000
商标: Bergquist Company
组装国: Not Available
扩散国家: Not Available
原产国: US
设计目的: Telecommunications, ASICs/DSPs, Consumer Electronics, Thermal Modules or Heat Sinks
产品类型: Thermal Interface Products
大小: 8 in x 16 in
工厂包装数量: 1
子类别: Thermal Management
商标名: GAP PAD
零件号别名: L8INW16INH0.06 PN0008397 2195378
单位重量: 439 g
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已选择的属性: 0

CNHTS:
8541900000
CAHTS:
8541900000
USHTS:
3919905060
JPHTS:
8542900006
KRHTS:
3919900000
TARIC:
8541900000
MXHTS:
3919909900
ECCN:
EAR99

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

数据中心应用

Bergquist Company数据中心应用采用有助于热管理、长期可靠性和应力保护的先进材料。随着数据分析、人工智能(AI)和高性能计算成为主流，数据中心的速度和容量都在飞速增长。这种需求的增加正在导致下一代数据中心的运行温度更高，而这种热量可能会降低性能。Bergquist Company设计和制造元件级热管理和应力保护产品，有助于满足这些增强的性能要求。

路由器交换机和网络应用

Bergquist Company的路由器交换机和网络应用包括相变材料和导热粘合剂，用于促进热敏元件散热。在服务器主板以及路由器和交换机的线卡中使用先进材料可带来诸多优势，例如降低规模和成本。单次性能的少量提升，在重复数千次后将能为路由器和交换机的性能带来显著影响。Bergquist Company的散热产品可帮助元件正常工作，实现最佳运行。

存储应用

Bergquist Company存储应用采用专用于存储硬件的先进材料，可提高可靠性、稳定性和传输速率。可靠性和性能的每次提升都可以降低成本，同时满足用户不断提高的期望。Bergquist Company的热管理材料包括多种类型的产品，以满足各种应用需求。

服务器应用

Bergquist Company服务器应用包括热管理产品，设计用于各种规模的应用 — 从单个机柜的少量服务器到数据中心的数千个服务器。无论服务器数量如何，热量略有降低或元件性能的改善都会显著影响基础设施的运行。Bergquist Company提供可用于整个电路板的先进材料，有助于优化性能和相应的网络。

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

5G Products

Bergquist 5G Products are designed to meet the demanding conditions required for 5G telecom infrastructure components. These highly stable interconnect materials provide fundamental electrical functions for dependable telecom infrastructure performance, ensuring reliable, long-term performance. The Bergquist 5G portfolio features multiple formats, including pads, gels, liquids, and adhesives, to maximize system reliability.

TGP HC5000 Highly Conformable GAP PAD®

Bergquist Company TGP HC5000 Highly Conformable GAP PAD® is a silicon-based 5.0 W/m-K high compliance GAP PAD that is non-electrically conductive and highly conformable. The HC5.0 GAP PAD is available in various thicknesses and custom part sizes and features low hardness and modules. The thermal interface is tacky on one side with a clear PET liner with reduced tack on one side and Blue Diamond liner. Bergquist Company TGP HC5000 Highly Conformable GAP PAD is easily reworkable.

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