IT3-300P-22H(03)

Hirose Connector
798-IT3-300P-22H03
IT3-300P-22H(03)

制造商:

说明:
板对板与夹层连接器 300P INTERPOSER 22MM HEIGHT

ECAD模型:
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库存量: 90

库存:
90 可立即发货
生产周期:
9 周 大于所示数量的预计工厂生产时间。
数量大于90的订购须受最低订购要求的限制。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:
此产品免运费

定价 (含13% 增值税)

数量 单价
总价
¥663.2987 ¥663.30
¥604.7421 ¥6,047.42
¥518.7152 ¥15,561.46
¥505.0648 ¥30,303.89
¥479.7528 ¥57,570.34

产品属性 属性值 选择属性
Hirose Electric
产品种类: 板对板与夹层连接器
RoHS:  
Plugs
300 Position
0.875 mm (0.034 in)
Solder
Vertical
22 mm
1 A
50 V
Gold
Copper Alloy
Liquid Crystal Polymer (LCP)
IT3
Tray
商标: Hirose Connector
组装国: Not Available
扩散国家: Not Available
原产国: MY
产品类型: Board to Board & Mezzanine Connectors
工厂包装数量: 30
子类别: Board to Board & Mezzanine Connectors
零件号别名: 636-0210-2-03
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CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

High Speed Board to Board Connectors

Hirose Electric produces a variety of High-Speed Board to Board Connectors. These High-Speed Board to Board Connectors are ideal for mezzanine applications, coplanar or vertical, with optional ground plates, and a wide range of positions and stacking heights. Hirose Connectors include the FX10, FX11, FX18, and IT3 series connectors.

Medical Solutions

Hirose Electric Medical Solutions include high-performance connectors engineered for precision, durability, and reliability in demanding applications. Products offered include board-to-board, wire-to-board, FPC/FFC, circular, and coaxial connectors with IP67/IP68 sealing to protect against debris, dust, and moisture ingress. Features include EMI shielding, extended mating cycles, and secure locking, ensuring stable interference-free performance. The miniaturized products from Hirose support compact, high-density systems, while hybrid signal/power designs and RoHS/IEC compliance meet the evolving needs of diagnostic imaging, patient monitoring, therapy systems, and wearable medical tech.

IT3 High-Speed BGA Mezz Connectors

Hirose IT3 High-Speed BGA Mezz Connectors transmit differential, single-ended, and power through one package. The stackable IT3 series (ranging from 15mm to 40mm) provides reliable connections for today's data rates, including PCIe and XAUI, as well as 10+ Gbps systems. Hirose IT3 High-Speed BGA Mezz Connectors offer a staggered 1.5mm x 1.75mm ball grid array. Additional features include 100, 200, and 300 contacts (+90% additional grounds), low mating/extracting forces, wide misalignment tolerances for multiple connector use, and excellent reflow solderability. The IT3 system features three basic components: the mating receptacle, the interposer, and the mounting receptacle. The mating and mounting receptacles are reflowed to the PCB, and different height interposer assemblies are selected to achieve the needed height between the PCBs.