M 系列 D-Sub后壳

结果: 86
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 类型 外壳大小 电缆引入角 电缆引入数量 外壳材质 外壳电镀 位置数量
Molex / AirBorn D-Sub后壳 .050" Low Profile Backshell Metal 无库存
最低: 10
倍数: 1

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Nickel 21 Position
Molex / AirBorn D-Sub后壳 CONNECTOR, M SERIES 无库存
最低: 10
倍数: 1

EMI/RFI Backshell Straight 1 Entry Aluminum Electroless Nickel 25 Position
Molex / AirBorn D-Sub后壳 EMI/RFI Backshell 无库存交货期 21 周
最低: 1
倍数: 1

EMI/RFI Backshell 2 (A) Straight 1 Entry Aluminum 15 Position
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD 无库存
最低: 10
倍数: 1
EMI/RFI Backshell 21 45 deg 1 Entry Aluminum Cadmium 21 Position
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD 无库存
最低: 10
倍数: 1
EMI/RFI Backshell 31 45 deg 1 Entry Aluminum Cadmium 31 Position
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC 无库存交货期 20 周

EMI/RFI Backshell 2 (A) Straight 1 Entry Aluminum Nickel 15 Position
Molex / AirBorn D-Sub后壳 CONNECTOR, M SERIES 无库存交货期 21 周
最低: 1
倍数: 1
EMI/RFI Backshell 45 deg 1 Entry Aluminum Cadmium 25 Position
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD
EMI/RFI Backshell 31 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 CONNECTOR, M SERIES
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 9 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 15 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 15 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 25 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 31 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 25 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 31 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 15 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 15 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 21 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 9 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 15 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 25 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 37 45 deg 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row NIC

EMI/RFI Backshell 37 45 deg 1 Entry Aluminum Electroless Nickel