AirBorn D-Sub后壳

结果: 86
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 类型 外壳大小 电缆引入角 电缆引入数量 外壳材质 外壳电镀 位置数量
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD
EMI/RFI Backshell 15 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD
EMI/RFI Backshell 21 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD
EMI/RFI Backshell 9 45 deg 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD
EMI/RFI Backshell 25 45 deg 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD
EMI/RFI Backshell 9 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 2 Row CAD
EMI/RFI Backshell 9 45 deg 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row CAD
EMI/RFI Backshell 69 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row CAD
EMI/RFI Backshell 51 45 deg 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row CAD
EMI/RFI Backshell 69 45 deg 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 .050" Low Profile Backshell Metal
EMI/RFI Backshell 51 Straight 1 Entry Aluminum Cadmium
Molex / AirBorn MM-332-051-AAA-4100
Molex / AirBorn D-Sub后壳 CONNECTOR, M SERIES

EMI/RFI Backshell Straight 1 Entry Aluminum Nickel 51 Position