5100 D-Sub后壳

结果: 13
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 类型 外壳大小 电缆引入角 电缆引入数量 外壳材质 外壳电镀 位置数量 封装
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC 5库存量
4在途量
最低: 1
倍数: 1

EMI/RFI Backshell 51 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 CONNECTOR, M SERIES 5库存量
最低: 1
倍数: 1

EMI/RFI Backshell 51 Straight 1 Entry Aluminum Nickel 51 Position
NorComp D-Sub后壳 9P 60D w/ Thmbscrw Black Plastic 86库存量
最低: 1
倍数: 1

Strain Relief Backshell 1 (E) 60 deg 1 Entry Polyamide (PA) 9 Position Bulk
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC 7库存量
7在途量
最低: 1
倍数: 1

EMI/RFI Backshell 51 45 deg 1 Entry Aluminum Electroless Nickel
NorComp D-Sub后壳 9P 60D w/ Thmbscrw Metalized Plastic 46库存量
最低: 1
倍数: 1

Strain Relief Backshell 1 (E) 60 deg 1 Entry Metallized Black Plastic 9 Position Bulk
Molex / AirBorn D-Sub后壳 Micro-D, Metal, Board Mount, Right Angle Receptacle, Compressed Footprint 无库存交货期 3 周
最低: 10
倍数: 1

Molex / AirBorn D-Sub后壳 .050" Low Profile Backshell Metal

EMI/RFI Backshell 51 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC

EMI/RFI Backshell 51 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Microminiature Series .050
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row NIC

EMI/RFI Backshell 51 Straight 1 Entry Aluminum Electroless Nickel
Molex / AirBorn D-Sub后壳 Rugged Backshell 3 Row CAD
EMI/RFI Backshell 51 45 deg 1 Entry Aluminum Cadmium
Molex / AirBorn D-Sub后壳 .050" Low Profile Backshell Metal
EMI/RFI Backshell 51 Straight 1 Entry Aluminum Cadmium
TE Connectivity BAG0051-00
TE Connectivity D-Sub后壳 MBDSM-U1SHR0-08-30-1-C-H