IBASE 模块化计算机 - COM

结果: 59
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 外观尺寸 处理器品牌 处理器类型 芯片组 频率 RAM最大容量 已安装RAM 最小工作温度 最大工作温度 尺寸
IBASE ET975K-I7e32
IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-7600U (2.8GHz/3.9GHz) onboard, DDR4 SO-DIMM x 2, , 2x DDI, I219LM x1, TPM(2.0), onboard eMMC 32GB, optional heatsink + cooler or heat spreader (RoHS2)

IBASE ET975K-I7Ve32
IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-7600U (2.8GHz/3.9GHz) onboard, DDR4 SO-DIMM x 2, 1x DDI+ 1x VGA, I219LM x1, TPM(2.0), onboard eMMC 32GB, optional heatsink + cooler or heat spreader (RoHS2)

IBASE ET975S-I7
IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-6600U (2.8GHz/3.9GHz) onboard, DDR4 SO-DIMM x 2, 2x DDI, I219LM x1, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS2)

IBASE ET975S-I7e32
IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-6600U (2.8GHz/3.9GHz) onboard, DDR4 SO-DIMM x 2, 2x DDI, I219LM x1, TPM(2.0), onboard eMMC 32GB, optional heatsink + cooler or heat spreader (RoHS2)

IBASE ET975S-I7Ve32
IBASE 模块化计算机 - COM COM Express (Type 6), Intel Core i7-6600U (2.8GHz/3.9GHz onboard, DDR4 SO-DIMM x 2, 1x DDI+ 1x VGA, I219LM x1, TPM(2.0),onboard eMMC 32GB, optional heatsink + cooler or heat spreader (RoHS2)

IBASE ET977-R2312LV
IBASE 模块化计算机 - COM COM Express (Type 6), AMD Ryzen R2312 onboard ,DDR4 SO-DIMMx 2, I211AT x1, supports 3x DDI and LVDS, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS)

IBASE ET977-R2314LV
IBASE 模块化计算机 - COM COM Express (Type 6), AMD Ryzen R2314 onboard ,DDR4 SO-DIMMx 2, I211AT x1, supports 3x DDI and LVDS, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS)

IBASE ET977-R2514LV
IBASE 模块化计算机 - COM COM Express (Type 6), AMD Ryzen R2514 onboard ,DDR4 SO-DIMMx 2, I211AT x1, supports 3x DDI and LVDS, TPM(2.0), optional heatsink + cooler or heat spreader (RoHS)

IBASE RM-N8MMI
IBASE 模块化计算机 - COM NXP Cortex -A53 i.MX 8M Mini Quad Industrial grade 1.6GHz, 2GB LPDDR4, 8GB MLC eMMC onboard Support: 1x MIPI-DSI 4-lane, 1x MIPI-CSI2 4-lane, 2x MMC/SDIO interface, 2x SPI/eSPI, 2x I2S, 4x I2C, 4x UART, 2x USB2, 1x PCIe(x1) Gen1, 1x GbE, GPIOs