S01-806005KIT

Harwin
855-S01-806005KIT
S01-806005KIT

制造商:

说明:
EMI组件 S01 EMC Shield Can Clip 0.20MM Thick Cans

ECAD模型:
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库存量: 40

库存:
40
可立即发货
在途量:
36
生产周期:
8
大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:
此产品免运费

定价 (含13% 增值税)

数量 单价
总价
¥363.3741 ¥363.37
¥324.988 ¥3,249.88

产品属性 属性值 选择属性
Harwin
产品种类: EMI组件
RoHS:  
S01
Kits
商标: Harwin
组装国: Not Available
扩散国家: Not Available
原产国: GB
产品类型: EMI Kits
工厂包装数量: 1
子类别: EMI/RFI
总件数: 27
商标名: EMC Shielding
单位重量: 40 g
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已选择的属性: 0

CNHTS:
7508909000
CAHTS:
8536690020
USHTS:
7506203000
JPHTS:
750620000
KRHTS:
8536691000
TARIC:
8536699099
MXHTS:
7506200200
BRHTS:
75062000
ECCN:
EAR99

EMC Shielding Can Development Kit

Harwin EMC Shielding Can Development Kit enables designers to make their own shield cans quickly and is ideal for fast prototyping. The kit contains full instructions along with do-it-yourself (DIY) shield can blanks and shield retention clips. The nickel-silver material provides effective and useable shielding with up to 24bB attenuation being achieved. The shield can in this Harwin development kit is removable for adjustment.

EMC Shield Cans

Harwin EMC Shield Cans provide excellent RFI and EMI protection to sensitive circuitry at the PCB level when combined with SMT shield clips. The simple one-piece, five-sided design provides cost-effectiveness compared to complex fence-and-lid or through-board cans. Harwin EMC Shield Cans are made of nickel silver and available in heights of 5mm (0.3mm thickness), 2.5mm, and 3mm (0.15mm or 0.2mm thickness). An EMC Shield Can Kit is also available, which allows users to customize their own shield can during the prototyping and development phase.

EZ-BoardWare RFI & SMT PCB Hardware

Harwin EZ-BoardWare RFI and SMT PCB Hardware products are all designed to simplify PCB production processes. The portfolio includes spring contacts, shield cans, shield can clips, coin cell holders, test points, and more. Harwin EZ-BoardWare RFI and SMT PCB Hardware products increase design flexibility and cost effectiveness.

EMC屏蔽解决方案

Harwin EMC屏蔽解决方案包括各种表面安装屏蔽固定夹、兼容屏蔽罩和弹簧触点,可解决各种EMI/RFI和接地问题。SMT元件采用卷带封装,不仅可实现自动化装配,还可降低生产成本。屏蔽罩和固定夹无需手动焊接,从而简化了生产并提高了可靠性。弹簧触点可防止RFI噪声,并在需要电气或接地连接时提供设计灵活性。