ADLINK Technology 半导体

结果: 623
选择 图像 零件编号
 制造商
描述 数据表 供货情况 单价（含13%增值税） 根据您的数量，按照单价筛选表格中的结果。
数量 RoHS
ADLINK Technology SUSB-4GB
ADLINK Technology USB闪存盘 4GB Low Profile USB flash module kit 无库存
最低： 1
倍数： 1

ADLINK Technology DDR5 4800 32GB SO-DIMM
ADLINK Technology 存储器模块 DDR5-4800, 32GB, 2Rx8 2Gx8, SO-DIMM 262P, 1.1V, Rank:2, CL40, OP Temp:0 95, Fix Die:No, Samsung Chip(2Gx8),
ADLINK Technology DDR4 2400 288P 16GB REG-DIMM
ADLINK Technology 存储器模块 DDR4-2400, 16GB, 2Gx72, R-DIMM 288P, 1.2V, Rank:2, CL17, ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1Gx8)
ADLINK Technology Starterkit-cKL-i7-7600U-M16G
ADLINK Technology 开发板与工具包 - x86 Starterkit-COM Express 6 PLUS with cExpress-KL-i7-7600U Compact size Type 6 module, H/P passive heatsink, 16GB DDR4 2133 non-ECC SODIMM, operating temperature 0C to 60C degree
3库存量
最低： 1
倍数： 1

ADLINK Technology I-PI WIFI DEV KIT w/ M.2 2242 AX210
ADLINK Technology 多协议开发工具 Wi-Fi 6E (6GHz), 2x2, Bluetooth 5.2, M.2 2230 module with antenna kit. The module supports dual-stream Wi-Fi in the 2.4GHz, 5GHz and 6GHz bands as well as Bluetooth 5.3. It also supports Wi-Fi 6 R2 features, including UL MU-MIMO1
ADLINK Technology 开发板和工具包 - ARM I-Pi SMARC Plus Prototype Kit for AIOT and robotics with LEC-MTK-I1200-4G-32G-BW-CT, low profile heatsink and i2s WM890 Audio (US 110/220V to 19V Adapter, USB debug cable)
数据表

ADLINK Technology I-COM HPC Ampere Altra DEV Kit-128
ADLINK Technology 开发板和工具包 - ARM COM HPC Ampere Altra development kit with module, with M128-26CPU, with carrier, heatsink and accessories
数据表

ADLINK Technology I-COM HPC Ampere Altra DEV Kit-96
ADLINK Technology 开发板和工具包 - ARM COM HPC Ampere Altra development kit with module, with M96-28 CPU, with carrier, heatsink and accessories
数据表

ADLINK Technology I-COM HPC Ampere Altra DEV Kit-64
ADLINK Technology 开发板和工具包 - ARM COM HPC Ampere Altra development kit with module, with Q64-22 CPU, with carrier, heatsink and accessories
数据表

ADLINK Technology I-COM HPC Ampere Altra DEV Kit-32
ADLINK Technology 开发板和工具包 - ARM COM HPC Ampere Altra development kit with module, with Q32-17 CPU, with carrier, heatsink and accessories
数据表

ADLINK Technology ASDSM8SHI-512GP0
ADLINK Technology 固态硬盘 - SSD ASD+S7T ASDSM8SHI-512GP0M.2 2280 512GB SATA III 6Gbps 3.3V +/- 5% Kioxia p-SLC BiCS5 550MB SR/510MB SW, TBW:26000TB, MTBF>3MH, OP Temp:-40C - 85C
数据表
更多信息可用
ADLINK Technology DDR3L 1600 204P 8GB NON-ECC SODIMM
ADLINK Technology 存储器模块 DDR3-1600, 8GB, 1024Mx64, SO-DIMM 204P, 1.35V, Rank:2, CL11, Non-ECC, OP Temp:0-85, Fix Die:No, Samsung Chip(1024Mx8x8), Height:30.0mm
ADLINK Technology 子卡和OEM板 SP2-15WP-TGL-i5, 8GB, w/ IO, 12V, CT
数据表

ADLINK Technology 界面开发工具 ADi-BACC-G2FThe ADi-BACC-G2F is IO extender breakout board by SPI and I2C interface. This board has below functions 32x GPI/32x GPO/8x 3A HC GPO/4x User LEDs/8x Meter sense/ 24x LED driver/1 wire bus/2x FS
数据表
ADLINK Technology 界面开发工具 The ADi-BACC-G3 is IO extender breakout board by SPI interface. This board has below functions 32x GPI/32x GPO/8x 3A HC GPO/9x Meter sense/1 wire bus/EP_FAIL
数据表
ADLINK Technology 硬盘驱动器 - HDD HDD, SATA, 6Gb/s 2.5" 7mm, 2TB 5400RPM Heads:4, Disk:2 Cache buffer:128MB

ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDED4EDE-128GT0 M.2 2242 B+M 128GB PCIe Gen3 OP Temp:-25C - 85C
数据表
ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDED4EDE-256GT0 M.2 2242 B+M 256GB PCIe Gen3 OP Temp:-25C - 85C
数据表
ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDED4EDE-512GT0 M.2 2242 B+M 512GB PCIe Gen3 OP Temp:-25C - 85C
数据表
ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDEM4EDE-128GT0 M.2 2242 128GB PCIe Gen3 OP Temp:-25C - 85C
数据表
ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDEM4EDE-1TBT0 M.2 2242 1TB PCIe Gen3 OP Temp:-25C - 85C
数据表
ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDEM4EDE-256GT0 M.2 2242 256GB PCIe Gen3 OP Temp:-25C - 85C
数据表
ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDEM4EDE-512GT0 M.2 2242 512GB PCIe Gen3 OP Temp:-25C - 85C
数据表
ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDEM8EDE-1TBT0 M.2 2280 1TB PCIe Gen3 OP Temp:-25C - 85C
数据表
ADLINK Technology 固态硬盘 - SSD ASD+E3T ASDEM8EDE-256GT0 M.2 2280 256GB PCIe Gen3 OP Temp:-25C - 85C
数据表