Microchip 分立半导体模块

结果: 138
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 产品 类型 技术 Vf - 正向电压 Vr - 反向电压 Vgs - 栅极-源极电压 安装风格 封装 / 箱体 最小工作温度 最大工作温度 封装
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-SP6P

MOSFET-SiC SBD Modules MOSFET / SiC SBD SiC 1.8 V 1.2 kV - 10 V, + 23 V Screw Mount - 40 C + 125 C
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-SP1F

MOSFET-SiC SBD Modules MOSFET / SiC SBD SiC 1.8 V 1.2 kV - 10 V, + 23 V Screw Mount - 40 C + 125 C
Microchip Technology 分立半导体模块 CC6565

Power Module 1 N-Channel SiC 1.75 V - 10 V, + 23 V Press Fit - 40 C + 175 C
Microchip Technology 分立半导体模块 CC6559

Power Module SiC 1.8 V - 10 V, + 23 V Press Fit - 40 C + 175 C
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-6HPD

MOSFET-SiC SBD Modules 3-Phase Bridge SiC 1.5 V - 10 V, + 23 V Screw Mount 108 mm x 67.3 mm x 17.2 mm - 55 C + 175 C
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-6HPD

MOSFET-SiC SBD Modules 3-Phase Bridge SiC 1.5 V - 10 V, + 23 V Screw Mount 108 mm x 67.3 mm x 17.2 mm - 55 C + 175 C
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-6HPD

MOSFET-SiC SBD Modules 3-Phase Bridge SiC 1.5 V - 10 V, + 23 V Screw Mount 108 mm x 76.3 mm x 17.2 mm - 55 C + 175 C
Microchip Technology 483-1
Microchip Technology 分立半导体模块 3 Phase Bridge
3-Phase Bridge 3-Phase Bridge Si
Microchip Technology 483-3
Microchip Technology 分立半导体模块 3 Phase Bridge
3-Phase Bridge 3-Phase Bridge Si
Microchip Technology MSCSM170AM039CT6AG
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-SP3F

MOSFET / SiC SBD SiC
Microchip Technology MSCSM170AM058CT6AG
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-SP3F

MOSFET / SiC SBD SiC
Microchip Technology MSCSM120XM31CTYZBNMG
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-6HPD

MOSFET-SiC SBD Modules MOSFET / SiC SBD SiC
Microchip Technology MSCSM70XM19CTYZBNMG
Microchip Technology 分立半导体模块 PM-MOSFET-SIC-SBD-6HPD

MOSFET-SiC SBD Modules MOSFET / SiC SBD SiC