TDK 距离传感器IC和嵌入式模块

结果: 7
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型
TDK InvenSense 距离传感器IC和嵌入式模块 Long Range Ultra-low Power Ultrasonic Time-of-Flight Range Sensor Pulse-Echo Applications 7,037库存量
最低: 1
倍数: 1
: 1,000

TDK InvenSense 距离传感器IC和嵌入式模块 Ultra-low Power Integrated Ultrasonic Time-of-Flight Range Sensor for Pulse-Echo Applications 1,255库存量
最低: 1
倍数: 1
: 1,000

TDK InvenSense 距离传感器IC和嵌入式模块 Ultra-low Power Integrated Ultrasonic Time-of-Flight Range Sensor for Pitch-Catch Applications 1,743库存量
最低: 1
倍数: 1
: 1,000

TDK InvenSense 距离传感器IC和嵌入式模块 Ultra-low Power Integrated Ultrasonic Time-of-Flight Range Sensor for Pulse-Echo Applications 745库存量
最低: 1
倍数: 1
: 1,000

TDK InvenSense 距离传感器IC和嵌入式模块 Ultra-low Power Integrated Ultrasonic Time-of-Flight Range Sensor for Pulse-Echo Applications 1,986库存量
1,000在途量
最低: 1
倍数: 1
: 1,000

TDK InvenSense 距离传感器IC和嵌入式模块 Long-Range Ultrasonic Time-of-Flight Range Sensor 1,061库存量
最低: 1
倍数: 1
: 1,000

TDK InvenSense 距离传感器IC和嵌入式模块 Ultra-low Power Integrated Ultrasonic Time-of-Flight Range Sensor for Pulse-Echo Applications