conga-HPC/cTLU Intel Tiger Lake-UP3 系列 CPU与芯片冷却器

结果: 4
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 高度 工作电源电压 系列
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
29 mm 12 VDC conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 29mm height and integrated 12V fan. All standoffs are M2.5mm thread.
29 mm 12 VDC conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.
28 mm conga-HPC/cTLU Intel Tiger Lake-UP3