GF1500-00-60-50cc

Bergquist Company
951-GF1500-60-50CC
GF1500-00-60-50cc

制造商:

说明:
导热接口产品 Gap Filler, 2-Part, No Spacer Beads, Pot Life=60m, 50cc, Gap Filler TGF1500/1500

ECAD模型:
下载免费库加载程序,将此文件转换,以供您的ECAD工具使用。了解详情。

库存量: 337

库存:
337
可立即发货
在途量:
245
生产周期:
4
大于所示数量的预计工厂生产时间。
最少: 1   倍数: 1
单价:
¥-.--
总价:
¥-.--
预估关税:

定价 (含13% 增值税)

数量 单价
总价
¥271.4938 ¥271.49
¥240.2267 ¥2,402.27
¥226.5989 ¥5,664.97
¥223.1185 ¥11,155.93
¥220.7681 ¥22,076.81
¥215.039 ¥53,759.75
500 报价

产品属性 属性值 选择属性
Bergquist Company
产品种类: 导热接口产品
RoHS:  
Gap Fillers / Gap Pads / Sheets
Liquid Gap Filler
Non-standard
Silicone Elastomer
1.8 W/m-K
Yellow, White
- 60 C
+ 200 C
UL 94 V-0
1500 / TGF 1500
Bulk
商标: Bergquist Company
组装国: US
扩散国家: Not Available
原产国: US
产品类型: Thermal Interface Products
工厂包装数量: 1
子类别: Thermal Management
商标名: Gap Filler
零件号别名: L50CCW0H0 SY BG429174 2167351
单位重量: 135 g
找到的产品:
要显示类似产品,至少选中一个复选框
要显示该类别下的类似产品,请至少选中上方的一个复选框。
已选择的属性: 0

此功能要求启用JavaScript。

CNHTS:
3824999999
CAHTS:
8541900000
USHTS:
3824999397
JPHTS:
8542900006
TARIC:
8541900000
MXHTS:
8541900299
ECCN:
EAR99

5G Products

Bergquist 5G Products are designed to meet the demanding conditions required for 5G telecom infrastructure components. These highly stable interconnect materials provide fundamental electrical functions for dependable telecom infrastructure performance, ensuring reliable, long-term performance. The Bergquist 5G portfolio features multiple formats, including pads, gels, liquids, and adhesives, to maximize system reliability.

Thermal Gap Fillers

Bergquist Company Thermal Gap Fillers are thermally conductive gap filling liquid materials that enhance thermal performance and enable easier dispensing application for high-volume manufacturing operations. These materials provide high thermal and mechanical performance while inducing virtually zero stress on electronic components during assembly, improving performance and reliability across device assemblies. The liquid, thermal gap filler materials self-level, fill intricate air voids, and conform to highly intricate topographies and multi-level surfaces. This allows delivery of better wet-out for optimized thermal resistance, generally lower than more solid pad-based mediums. Thixotropic qualities also mean the gap fillers hold shape when dispensed.

数据中心应用

Bergquist Company数据中心应用采用有助于热管理、长期可靠性和应力保护的先进材料。随着数据分析、人工智能(AI)和高性能计算成为主流,数据中心的速度和容量都在飞速增长。这种需求的增加正在导致下一代数据中心的运行温度更高,而这种热量可能会降低性能。Bergquist Company设计和制造元件级热管理和应力保护产品,有助于满足这些增强的性能要求。

路由器交换机和网络应用

Bergquist Company的路由器交换机和网络应用包括相变材料和导热粘合剂,用于促进热敏元件散热。在服务器主板以及路由器和交换机的线卡中使用先进材料可带来诸多优势,例如降低规模和成本。单次性能的少量提升,在重复数千次后将能为路由器和交换机的性能带来显著影响。Bergquist Company的散热产品可帮助元件正常工作,实现最佳运行。