-ar 多协议模块

结果: 198
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 系列 频率 输出功率 接口类型 电源电压-最小 电源电压-最大 最小工作温度 最大工作温度 天线连接器类型 尺寸 协议 - 蓝牙、BLE - 802.15.1 协议 - 蜂窝、Nbiot、LTE 协议 - GPS、GLONASS 协议 - Sub GHz 协议 - WiFi - 802.11 协议 - ANT、Thread、Zigbee - 802.15.4 封装

Espressif Systems 多协议模块 ESP32-C6-MINI-1 and ESP32-C6-MINI-1U are two powerful, general-purpose Wi-Fi, IEEE 802.15.4, and Bluetooth LE modules. The rich set of peripherals and high performance make the module an ideal choice for smart homes, industrial automation, health car 1,330库存量
5,490在途量
最低: 1
倍数: 1
卷轴: 650

2.4 GHz 20.5 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 105 C PCB 13.2 mm x 16.6 mm x 2.4 mm Bluetooth 5.0 802.11 b/g/n Reel, Cut Tape
Ezurio 多协议模块 Bluetooth Module, BL54L10, Bluetooth LE, nRF54L10 chip, Trace ANT 225库存量
最低: 1
倍数: 1

BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio 多协议模块 Bluetooth Module, BL54L15 , Bluetooth LE, nRF54L15 chip, Trace Pin 122库存量
最低: 1
倍数: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Silicon Labs 多协议模块 Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module 1,121库存量
最低: 1
倍数: 1
卷轴: 1,000

2.4 GHz 17 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C u.FL 17.8 mm x 12.9 mm x 2.3 mm Bluetooth Thread, Zigbee Reel, Cut Tape
Ezurio 多协议模块 BL654 - Bluetooth v5 / 802.15.4 / NFC Module (Nordic nRF52840) Integrated Antenna - Cut tape 1,519库存量
最低: 1
倍数: 1

BL654 2.4 GHz 8 dBm GPIO, I2C, SPI, UART, USB 1.7 V 3.6 V - 40 C + 85 C PCB 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio 多协议模块 BLE module BL653 (Nordic nRF52833) Trace pin 1,756库存量
最低: 1
倍数: 1

BL653 2.4 GHz 8 dBm GPIO, I2C, I2S, SPI, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 Thread Cut Tape
AcSiP 多协议模块 AI7931LD - 多协议模块 WIFI6 Dual Band 2.4/5GHz M33 SoC Module 122库存量
最低: 1
倍数: 1

WIFI 300 MHz ADC, GPIO, I2C, I2S, IR, PWM, SDIO, SPI, UART 2.97 V 3.63 V - 40 C + 85 C 32 mm x 32 mm x 2.7 mm Bluetooth 5.0 802.11 a/b/g/n/ac/ax Bag
Silicon Labs 多协议模块 Mighty Gecko ARM Cortex-M4 256 kB flash, 32 kB RAM module 1,000库存量
最低: 1
倍数: 1
卷轴: 1,000

2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Chip 17.8 mm x 12.9 mm x 2.3 mm Bluetooth Thread, Zigbee Reel, Cut Tape, MouseReel
Silicon Labs 多协议模块 MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 397库存量
300在途量
最低: 1
倍数: 1

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified. 200库存量
200在途量
最低: 1
倍数: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 125 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs 多协议模块 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified 774库存量
最低: 1
倍数: 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 6库存量
最低: 1
倍数: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel

Silicon Labs 多协议模块 Mighty Gecko ARM Cortex-M4 512 kB flash, 64 kB RAM module 761库存量
最低: 1
倍数: 1

MGM13P 2.4 GHz 10 dBm I2C, UART, USART 1.8 V 3.8 V - 40 C + 85 C Built-In 12.9 mm x 17.8 mm x 2.3 mm Bluetooth Thread, Zigbee Cut Tape
Telink 多协议模块 Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this 6库存量
最低: 1
倍数: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 26 mm x 11.3 mm x 2.6 mm Reel
Silicon Labs 多协议模块 Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified. 99库存量
最低: 1
倍数: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 105 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Microchip Technology 多协议模块 Bluetooth LE and 802.15.4 module, 2MB Flash, 512KB RAM, 82LD, u.FL connector 295库存量
最低: 1
倍数: 1
16 MHz - 108 dBm, - 102 dBm, - 98 dBm, - 95 dBm I2C, SPI, USART 1.9 V 3.6 V - 40 C + 85 C U.FL 19 mm x 25 mm x 2.75 mm Bluetooth 802.15.4 Tray
Ezurio 多协议模块 BLE module BL653 (Nordic nRF52833) Trace pin 907库存量
最低: 1
倍数: 1
卷轴: 1,000

BL653 2.4 GHz 8 dBm GPIO, I2C, I2S, SPI, UART, USB 1.7 V 5.5 V - 40 C + 105 C External 15 mm x 10 mm x 2.2 mm Bluetooth LE NFC 802.15.4 Thread Reel, Cut Tape
Espressif Systems 多协议模块 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 669库存量
最低: 1
倍数: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Espressif Systems 多协议模块 "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for 3,461库存量
最低: 1
倍数: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Jorjin 多协议模块 Based on STM BlueNRG-2 + S2-LP and supports Sigfox and BLE5.0 1,623库存量
最低: 1
倍数: 1
卷轴: 550

860 MHz to 943 MHz, 2.4 GHz 8 dBm, 27 dBm I2C, SPI, UART 1.8 V 3.6 V - 40 C + 85 C 22 mm x 22 mm x 2.8 mm Bluetooth Sub GHz Reel, Cut Tape, MouseReel
Quectel 多协议模块 Embedded, 2400-2500 MHz, 4900-5850 MHz,5925-7125MHz, Wi-Fi (Bluetooth), PFC with cable, 100 +/-2 mm, IPEX ?(U.FL Generation ?), Adhesive, 28.9x11x0.2 136库存量
最低: 1
倍数: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Embedded Artists 多协议模块 2FY M.2 Module 57库存量
6在途量
最低: 1
倍数: 1

2.4 GHz to 2.484 GHz 9 dBm Audio, SDIO, UART 3.15 V 3.46 V - 40 C + 85 C U.FL Bluetooth 5.0 802.11a/b/g/n/ac/ax, 6/6E Bulk
Quectel 多协议模块 Embedded, 0-6000, Cable assembly, 200, -, RP-SMA-female to IPEX ? 15库存量
最低: 1
倍数: 1
21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GLONASS, GPS
CEL 多协议模块 BT5.0/NFC 1.6Mb Flash, PCB Antenna REEL 600库存量
最低: 1
倍数: 1
卷轴: 600

2.4 GHz 10 dBm GPIO 3 V 3.6 V - 40 C + 105 C PCB 16.64 mm x 23.88 mm x 4.17 mm Bluetooth 5.0 NFC Reel, Cut Tape
Quectel BG95M3LBTEA-64-SGNS
Quectel 多协议模块 1库存量
1在途量
最低: 1
倍数: 1

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS