congatec CPU与芯片冷却器

结果: 101
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 高度 深度 宽度 工作电源电压 功率额定值 系列
JUMPtec CPU与芯片冷却器 COMe Active Uni Cooler (w/o HSP) 43库存量
最低: 1
倍数: 1
14 mm 78 mm 87 mm 20 W
JUMPtec CPU与芯片冷却器 HSK COMe-Basic passive (w/o HSP) 7库存量
7在途量
最低: 1
倍数: 1
JUMPtec CPU与芯片冷却器 HSK COMe-Basic active (w/o HSP)
最低: 1
倍数: 1

JUMPtec CPU与芯片冷却器 HSP COMe-cAP6 Cu-core threaded
最低: 1
倍数: 1

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler (w/o HSP) N/A
最低: 1
倍数: 1

14 mm 78 mm 87 mm


congatec CPU与芯片冷却器 Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

congatec HPC/sILH-CSA-HP-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC Server modules conga-HPC/sILH with integrated heat pipes, 32.9mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5.
32.9 mm 12 VDC
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.

conga-MA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 * Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

conga-SA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread

conga-TCA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU与芯片冷却器 Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm.
27.3 mm 12 VDC conga-JC370
congatec CPU与芯片冷却器 Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm.
27.3 mm 12 VDC conga-JC370
congatec HPC/cALP-CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
29 mm 12 VDC
congatec conga-TCR8/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

congatec conga-HPC/mRLP-CSA-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

congatec conga-HPC/mRLP-CSP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.

JUMPtec CPU与芯片冷却器 COMe Active Uni Cooler2 (w/o HSP)

JUMPtec 51099-0000-99-1
JUMPtec CPU与芯片冷却器 SMARC Passive Uni Cooler (w/o HSP)
congatec conga-HPC/mRLP-CSA-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.

congatec CPU与芯片冷却器 *Passive cooling for Pico ITX module conga-PA7*For CPUs with standard silicone die*Four stand-offs M2.5 threaded
conga-PA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded

conga-MA7 Intel Elkhart Lake
JUMPtec CPU与芯片冷却器 HSP COMe-cAP6 Cu-core through

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 slim (w/o HSP)

JUMPtec CPU与芯片冷却器 COMe Passive Uni Cooler2 (w/o HSP)