congatec CPU与芯片冷却器

结果: 101
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 高度 深度 宽度 工作电源电压 功率额定值 系列
JUMPtec CPU与芯片冷却器 HSP COMe-bV26 Cu-core threaded

JUMPtec CPU与芯片冷却器 HSP COMe-bV26 Cu-core through

JUMPtec CPU与芯片冷却器 HSP COMe-bTL6 Cu-core threaded

JUMPtec CPU与芯片冷却器 HSP COMe-bTL6 Cu-core through

JUMPtec CPU与芯片冷却器 HSP COMe-bID7 (E2) Cu-core threaded

JUMPtec CPU与芯片冷却器 HSP COMe-bID7 (E2) Cu-core through

JUMPtec CPU与芯片冷却器 HSP COMh-sdID (E2) thread

JUMPtec CPU与芯片冷却器 HSP COMh-sdID (E2) through

JUMPtec CPU与芯片冷却器 Cooling COMh-sdID (E2): Adapter

JUMPtec CPU与芯片冷却器 Cooling COMh-sdID (E2): Backplate

JUMPtec CPU与芯片冷却器 Cooling COMh-sdID (E2): Cooler-LGA115x

JUMPtec CPU与芯片冷却器 COMh Size D Active Uni Cooler (w/o HSP)

JUMPtec CPU与芯片冷却器 COMh Size D Passive Uni Cooler (w/o HSP)

congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.
conga-QA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole.
conga-QA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded.
conga-QA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors.All standoffs are M2.5x0.45p threaded.
conga-QA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 *Passive cooling for Pico ITX board conga-PA7*For boards with IHS CPU*Four stand-offs threaded M2.5

conga-PA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. bore hole
conga-TCA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. bore hole
conga-TCA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COM Express Compact module conga-TCA7 with open silicon Intel Pentium and Celeron processor. thread
conga-TCA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are with 2.7mm bore hole.
conga-MA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with open-die Intel Pentium/Celeron Nxxx processor. All standoffs are M2.5 threaded
conga-MA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 * Passive cooling solution for SMARC 2.0 module conga-SA7* For modules with open-die Intel Pentium/Celeron processor* All stand-offs are with 2.7mm bore hole
conga-SA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
25.5 mm 12 VDC conga-TC570 Intel Tiger Lake-UP3