-ar CPU与芯片冷却器

结果: 78
选择 图像 零件编号 制造商 描述 数据表 供货情况 单价(含13%增值税) 根据您的数量,按照单价筛选表格中的结果。 数量 RoHS ECAD模型 高度 深度 宽度 工作电源电压 功率额定值 速度 气流 系列
iWave Global CPU与芯片冷却器 Arria 10 SoC SOM module Fansink 4库存量
3在途量
最低: 1
倍数: 1
60 mm 11 mm 60 mm 5 VDC 18.14 CFM (0.51 m3/min) iW-FSKALU
Arbor Technology HS-55E0-C1
Arbor Technology CPU与芯片冷却器 CPU Cooler (114*95*29mm) of EmETX-a55E0 for 18W APU 无库存
最低: 1
倍数: 1

18 W
Arbor Technology CPF-67M0-C1
Arbor Technology CPU与芯片冷却器 CPU Cooler with fan for rPGA988 CPUs 无库存
最低: 1
倍数: 1

Arbor Technology CPF-67Q0-C1
Arbor Technology CPU与芯片冷却器 CPU Cooler with fan for LGA1155/1156 CPU 无库存
最低: 1
倍数: 1

Arbor Technology CPF-0000-C1
Arbor Technology CPU与芯片冷却器 5400RPM CPU Fan for HS-0000-W1 无库存交货期 16 周
最低: 100
倍数: 100

4500 RPM
Arbor Technology HS-56M0-C1
Arbor Technology CPU与芯片冷却器 Heatspreader with fan for EmNANO-a56M0 无库存
最低: 1
倍数: 1



congatec CPU与芯片冷却器 Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

congatec CPU与芯片冷却器 Passive cooling for SMARC 2.0 module conga-SA7* For modules with lidded Intel Atom processor* All stand-offs are with 2.7mm bore hole

conga-SA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.

conga-MA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.

28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec conga-HPC/mRLP-CSA-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.

congatec HPC/cALP-CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/cALP with integrated heat pipes, 29mm height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
29 mm 12 VDC
congatec conga-HPC/mRLP-CSP-B
congatec CPU与芯片冷却器 Standard passive cooling solution for COM-HPC module conga-HPC/mRLP with 24.2mm overall heat sink height. All standoffs are with 2.7mm bore hole.

congatec conga-TCR8/CSA-HP-B
congatec CPU与芯片冷却器 Standard active cooling solution for high performance COM Express module conga-TCR8 with integrated heat pipes and 12V fan. All standoffs are with 2.7mm bore hole.

congatec conga-HPC/mRLP-CSA-T
congatec CPU与芯片冷却器 Standard active cooling solution for COM-HPC module conga-HPC/mRLP with 25mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm threaded.

congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are with 2.7mm bore hole.

conga-QMX8
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QMX8 with lidded NXP i.MX 8 ARM Cortex-A72 processor. All standoffs are M2.5mm thread.

conga-QMX8
congatec CPU与芯片冷却器 Passive cooling solution for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are M2.5 threaded

conga-MA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7 with open-die Intel Pentium/Celeron J and N processors.All standoffs are M2.5x0.45p threaded.
conga-QA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7with open-die Intel Pentium/Celeron J and N processors. All standoffs are with 2.7mm bore hole.
conga-QA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for SMARC 2.0 module conga-SA7* For modules with open-die Intel Pentium/Celeron processor* All stand-offs are with 2.7mm bore hole
conga-SA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.
conga-QA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Passive cooling solution for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are M2.5x0.45p threaded.
conga-QA7 Intel Elkhart Lake
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with M2.5mm thread.
28 mm conga-HPC/cTLU Intel Tiger Lake-UP3
congatec CPU与芯片冷却器 Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLH with integrated heatpipe, 29mm height. All standoffs are with M2.5mm thread.
29 mm conga-HPC/cTLH Intel Tiger Lake-H