新款开发板和工具包 - ARM
Renesas Electronics EK-RA8P1评估套件提供评估RA8P1微控制器的必要要求和接口选项。RA8P1是采用先进的TSMC 22nm ULL工艺生产的支持人工智能的单核和双核MCU。借助Ethos-U55的硬件人工智能加速和Cortex-M85芯体的更高性能，再加上大存储器和丰富的外设集，RA8P1 MCU成为各种语音和视觉人工智能以及实时分析的理想之选。
-
Renesas Electronics EK-RA8P1 评估套件提供评估RA8P1微控制器的必要要求和接口选项。2025/6/27
-
NXP Semiconductors S32K312MINI-EVB评估板采用Arm® Cortex®-M7内核，带浮点单元 (FPU)，运行频率为120MHz。2025/6/23 -
Arduino Modulino® ThermoPlug-and-play temperature sensing module built around the HS3003 humidity and temperature sensor.2025/6/12 -
Arduino Modulino® BuzzerVersatile audio output module that helps users add simple tones and sound effects to projects.2025/6/12 -
Arduino Modulino® DistanceDesigned for precise proximity sensing using the VL53L4CD time-of-flight (ToF) sensor.2025/6/12 -
Arduino Modulino® KnobFeatures a quadrature rotary encoder (PEC11J-9215F-S0015) paired with an onboard STM32C011F4 MCU.2025/6/12 -
Arduino Modulino® ButtonsFeatures three tactile push-buttons, each equipped with an RGB LED for customizable visual feedback.2025/6/12 -
Arduino Modulino® MovementPlug-and-play motion-sensing module built around the LSM6DSOXTR 6-axis IMU.2025/6/12 -
Arduino Modulino® PixelsVibrant and compact RGB LED module designed to bring dynamic visual feedback to Arduino projects.2025/6/12 -
Infineon Technologies PSOC™ 4 HVMS Lite套件设计用于加速PSOC ™ 4 HVMS系列的开发并提供单芯片解决方案。2025/6/3 -
MYIR MYD-YR3506 Development BoardsBuilt around the MYC-YR3506 System-On-Modules (SOMs) and powered by the Rockchip RK3506 processor.2025/5/28 -
MYIR MYD-YR3562 Development BoardsDesigned to evaluate the MYD-YR3562 System-on-Modules (SOMs) and come with a 3.5mm audio interface.2025/5/28 -
Advantech MIC-732D-AO NVIDIA® Isaac Nova Orin™ AI开发套件设计用于MIC-732-AO，以形成一体化的AMR AI系统和开发套件。2025/5/27 -
Renesas Electronics EK-RZ/A3M MPU评估套件该套件采用RZ/A3M MPU，有助于开发HMI和其他嵌入式系统应用。2025/5/20 -
Infineon Technologies CY8CPROTO-041TP PSOC™ 4100T Plus原型开发套件该原型设计套件用于PSOC™ 4100T Plus MCU，采用英飞凌第五代CAPSENSE™ 技术。2025/5/20 -
Octavo Systems OSDZU3-REF Development PlatformDevelopment platform for the evaluation of the OSDZU3 SiP (System-in-Package).2025/5/13 -
Renesas Electronics FPB-RA0E2快速原型设计板用于着手评估、原型设计和开发RA0E2 MCU。2025/4/24 -
Texas Instruments F29H85X评估板和套件用于TI C2000™ MCU系列的F29H85x和/或F29P58x器件。2025/4/24 -
ROHM Semiconductor RB-D63Q2537和RB-D63Q2557参考板支持测试ML63Q2537和ML63Q2557 32位微控制器 (MCU) 的运行情况。2025/4/21 -
STMicroelectronics 用于 STM32WBA65I-DK1 的 STM32WBA65RI 探索套件套件采用STM32WBA65RI微控制器作为完整的演示和开发平台。2025/4/17 -
STMicroelectronics 用于STM32C092RC的NUCLEO-C092RC Nucleo-64开发板支持ARDUINO® Uno V3连接和ST morpho接头，用于全面访问STM32 I/O。2025/4/10 -
STMicroelectronics NUCLEO-C051C8 STM32 Nucleo-64开发板通过STM32微控制器提供性能，提供一个经济、灵活的原型设计构建方法。2025/4/9 -
Microchip Technology SAM E54 Curiosity Ultra开发板 (EV66Z56A)具有集成的编程器和调试器，因此无需额外硬件即可开始使用。2025/4/7 -
NXP Semiconductors FRDM i.MX 91开发板设计目的：为初级Linux®评估提供支持，帮助开发人员加速产品开发。2025/3/27 -
STMicroelectronics STEVAL-ROBKIT1机器人评估套件一款全功能套件，旨在为机器人技术和应用的开发提供平台。2025/3/27