新款嵌入式处理器开发套件
Renesas Electronics EK-RA8P1评估套件提供评估RA8P1微控制器的必要要求和接口选项。RA8P1是采用先进的TSMC 22nm ULL工艺生产的支持人工智能的单核和双核MCU。借助Ethos-U55的硬件人工智能加速和Cortex-M85芯体的更高性能，再加上大存储器和丰富的外设集，RA8P1 MCU成为各种语音和视觉人工智能以及实时分析的理想之选。
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Renesas Electronics EK-RA8P1 评估套件提供评估RA8P1微控制器的必要要求和接口选项。2025/6/27
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Silicon Labs Amazon Sidewalk无线xG28 Explorer套件为EFR32SG28双频无线SoC提供小尺寸、低成本的评估平台。2025/6/26 -
NXP Semiconductors S32K312MINI-EVB评估板采用Arm® Cortex®-M7内核，带浮点单元 (FPU)，运行频率为120MHz。2025/6/23 -
NXP Semiconductors S32E288-975EVB 评估板设计目的是评估S32E2高性能实时处理器的性能。2025/6/16 -
Arduino Modulino® ThermoPlug-and-play temperature sensing module built around the HS3003 humidity and temperature sensor.2025/6/12 -
Arduino Modulino® BuzzerVersatile audio output module that helps users add simple tones and sound effects to projects.2025/6/12 -
Arduino Modulino® DistanceDesigned for precise proximity sensing using the VL53L4CD time-of-flight (ToF) sensor.2025/6/12 -
Arduino Modulino® KnobFeatures a quadrature rotary encoder (PEC11J-9215F-S0015) paired with an onboard STM32C011F4 MCU.2025/6/12 -
Arduino Modulino® ButtonsFeatures three tactile push-buttons, each equipped with an RGB LED for customizable visual feedback.2025/6/12 -
Arduino Modulino® MovementPlug-and-play motion-sensing module built around the LSM6DSOXTR 6-axis IMU.2025/6/12 -
Arduino Modulino® PixelsVibrant and compact RGB LED module designed to bring dynamic visual feedback to Arduino projects.2025/6/12 -
M5Stack C145 & K145 Tab5 IoT Development KitsPortable smart IoT devices that integrate a dual-chip architecture and abundant hardware resources.2025/6/6 -
M5Stack Dial v1.1 Development BoardHigh-performance, multifunctional embedded board fully upgraded from the original dial product.2025/6/4 -
Infineon Technologies PSOC™ 4 HVMS Lite套件设计用于加速PSOC ™ 4 HVMS系列的开发并提供单芯片解决方案。2025/6/3 -
MYIR MYD-YR3506 Development BoardsBuilt around the MYC-YR3506 System-On-Modules (SOMs) and powered by the Rockchip RK3506 processor.2025/5/28 -
MYIR MYD-YR3562 Development BoardsDesigned to evaluate the MYD-YR3562 System-on-Modules (SOMs) and come with a 3.5mm audio interface.2025/5/28 -
Advantech MIC-732D-AO NVIDIA® Isaac Nova Orin™ AI开发套件设计用于MIC-732-AO，以形成一体化的AMR AI系统和开发套件。2025/5/27 -
Renesas Electronics EK-RZ/A3M MPU评估套件该套件采用RZ/A3M MPU，有助于开发HMI和其他嵌入式系统应用。2025/5/20 -
Infineon Technologies CY8CPROTO-041TP PSOC™ 4100T Plus原型开发套件该原型设计套件用于PSOC™ 4100T Plus MCU，采用英飞凌第五代CAPSENSE™ 技术。2025/5/20 -
Octavo Systems OSDZU3-REF Development PlatformDevelopment platform for the evaluation of the OSDZU3 SiP (System-in-Package).2025/5/13 -
Lantronix Open-Q™ 8550CS SOM Development KitDesigned to facilitate easy evaluation of the key features of the Qualcomm® Dragonwing™ QCS8550 SoM.2025/5/7 -
Renesas Electronics FPB-RA0E2快速原型设计板用于着手评估、原型设计和开发RA0E2 MCU。2025/4/24 -
Texas Instruments F29H85X评估板和套件用于TI C2000™ MCU系列的F29H85x和/或F29P58x器件。2025/4/24 -
Texas Instruments C-GANG低成本群组编程器该低成本群组编程器一次可对多达六个目标进行编程，且与MSPM0/MSP430器件兼容。2025/4/24 -
ROHM Semiconductor RB-D63Q2537和RB-D63Q2557参考板支持测试ML63Q2537和ML63Q2557 32位微控制器 (MCU) 的运行情况。2025/4/21